Wanted: Manufacturers Capable of Precision Bonding Inconel 625

OMEP is seeking manufacturers capable of precision bonding Inconel 625 as part of our work with RAPID.

The application is to bond multiple layers of 0.5mm Inconel 625 to form a microchannel plate and frame heat exchanger.  The design is substantially similar to the photo on the left.  Bonding is required between lamina A and B.

  1. At the periphery (note lamina B has a raised flange to meet the bottom edge of lamina A) and
  2. Around the edges of the two embossed holes in lamina A (raised to meet the bottom of lamina B)

Other important notes

  • These plates will be stacked with 8 pairs + 1.
  • Final design will have supporting ridges at same height as welding boss in lamina A.
  • Cross-sectional height tolerances of 0.5 mm tall channels are 15 micrometers (key).
  • 2 to 4 assemblies will be procured.
  • Hemmed flange in picture has been designed out.

If you are interested in this opportunity, please contact David McFeeters Krone at dmk@intelassets.com  or call him at 503 493-0477 (work)